PCB East 2026 has sold out its exhibition floor with strong exhibitor growth. Can AI design the very chips that power it? A new push into AI-driven semiconductor development aims to cut years off design cycles and reshape how advanced chips are built.

PCB East 2026 exhibition floor is sold out, with more than 85 exhibitors and expanded participation including AMD, Cadence/EMA, Indium, Lattice and Parmi.

The major EDA software companies are, in different ways, missing the real opportunity to use AI to change what kinds of hardware–software systems users can verify at all, rather than just speeding up what users already do.

The April digital issue of Circuits Assembly/PCD&F is now live, featuring coverage on UHDI solder mask challenges, AI adoption in engineering workflows, flex and rigid-flex design fundamentals, PCB fabrication tolerances, supply chain transparency risks and more.

Sustainable PCB substrates, including ceramics, halogen-free FR-4 and bio-based materials, are gaining attention as engineers address rising e-waste and circular design challenges.

Seika Machinery introduces Slot-Die Coater for thin-film deposition.

Hanwha Semitec introduced DECAN S1 Plus, S2 Plus chip mounter.

PCEA is offering free technical sessions and a keynote at PCB East 2026, covering AI, UHDI, simulation and PCB design best practices.

Karen Burnham highlights key EMC challenges in PCB design and emphasizes integrating EMC early in high-speed layouts ahead of PCB East 2026 on the PCB Chat podcast.

CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.

Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.

CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Cognichip raises $60M to develop AI tools for chip design, aiming to cut development time and costs by accelerating semiconductor engineering workflows.

A major Ajinomoto shareholder has requested a price increase of more than 30% for its interlayer insulating material.

AI and semiconductor companies saw gains after signals the Iran conflict could ease within weeks, lifting sentiment across the tech sector.

Storskogen acquires 90 percent of Darlington EMS, adding UK-based electronics manufacturing capacity and $10.2M in annual revenue.

SEMI projects global 300mm fab equipment spending to reach $133B in 2026 and surpass $150B in 2027, driven by AI demand and advanced node investment.

AI is rapidly reshaping Silicon Valley, driving layoffs, leaner teams and new software development models as companies adopt automation and shift investment toward AI.

Singapore charges a third individual in an AI chip fraud case tied to misleading a US server supplier about end-user purchases.

MK Electron will accelerate new businesses including solder paste and palladium alloys as part of its growth strategy.

Lacroix reports 2025 revenue of $48M, down 6.5 percent year over year, as electronics demand declined.

Eltek has received purchase orders for rigid-flex PCBs totaling approximately $5.3M from an international customer.

Distron adds in-house automated conformal coating.

Foxconn appointed Michael Chiang rotating CEO effective April 1.

Eastek appointed David Strabel vice president of manufacturing.

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EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.