Korea Circuit has won a large order from STMicroelectronics to supply it with FC-BGA substrates.
A 2 trillion yen ($14 billion) tender offer for troubled electronics and energy giant Toshiba by a Japanese consortium has been completed, clearing the way for it to be delisted.
China has reportedly increased its semiconductor equipment localization rate to over 40% amid US efforts to slow the nation’s development.
Zhiboxin Group broke ground on a 5 billion yuan ($685 million) PCB production base in the Jinxian Industrial Park in Nanchang, China.
How Apple's latest iPhone sells in China is under close scrutiny by fans and market watchers alike.
Industry 4.0 requires connectivity among partners.
A “China plus one” policy requires a delicate balancing act.
Obsolescence management begins at product design.
Cadence Design Systems and the Vietnam National Innovation Center have launched a new program aimed at accelerating IC design innovation in Vietnam.
Hyve Solutions opened new surface mount technology lines to expand its US manufacturing capabilities.