From tariff-free chip proposals to tightening copper markets and steep memory-price hikes, the global electronics ecosystem is bracing for turbulence as AI demand accelerates and nations race to secure stronger digital and telecom infrastructure.

Oxford researchers unveil air-powered soft robots that synchronize movement without electronics, using modular fluidic units to generate fully mechanical intelligence.

UC Santa Cruz researchers work on diamond-based fusion sensors signals early advances toward radiation-hard components that could eventually integrate into next-generation circuit assemblies.

Europe accelerates circular-electronics innovation with EU-backed projects replacing scarce materials and redesigning devices for reuse, repair and reduced e-waste.

PCEA has issued a call for abstracts for PCB West 2026, with submissions due January 23, 2026.

ioTech releases the io600 continuous laser assisted deposition system.

PCB West 2026 will take place Sept. 29–Oct. 2 at the Santa Clara Convention Center, with booth registration opening today for returning exhibitors.

PCB West 2025 reported a 3.5 percent year-over-year attendance increase, drawing a strong international crowd to its Santa Clara conference and exhibition.

Circuits Assembly opened entries for its 2026 NPI Awards, recognizing innovations in electronics assembly equipment, material and software.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

US chipmakers urge tariff-free treatment for North American semiconductors under the USMCA, calling it key to a resilient, integrated regional supply chain.

Analysts warn copper is primed for a renewed surge, with AI-driven power demand and deepening supply deficits setting the stage for record-level price pressure.

Samsung lifts server-memory prices by up to 60 percent as shortages deepen, intensifying strain on data-center builders while boosting its own chip margins.

Brandworks closes an $11M Series A to scale AI hardware, IoT platforms and launch a new design center in Taiwan.

SMIC says mounting fears of a deepening memory-chip shortage are causing customers to delay first quarter orders.

Fabric8Labs raises $50M to scale its US ECAM manufacturing capacity from 5M to 22M components a year for AI, RF and power applications.

Neways opens its largest Slovak facility with a $30.2M investment.

DDR5 solidifies as the 2026 memory standard, with power-control redesigns driving demand and lifting earnings.

Lite-On boosts its Vietnam footprint with another $200M investment, bringing its total commitment past $1B as new facilities ramp toward 2028.

The Analysis of Variance: Drawing Conclusions from Data that are Correct, Unambiguous and Defensible
PCD&F/CIRCUITS ASSEMBLY

Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints
Journal of Electronic Materials

Printed Circuit Board Substrates Derived from Lignocellulose Nanofibrils for Sustainable Electronics Applications
Scientific Reports

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.