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December 10th, 2025
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

China signaled support for deeper cooperation with the United States following the latter’s export approval of Nvidia’s H200 AI chips, as a new regional analysis shows Singapore, Malaysia, Vietnam and Thailand rapidly moving up the semiconductor value chain.

TECH NEWS

PCEA reports that PCB East 2026 exhibition space is more than 70% booked and on track to sell out, with the event moving to the DCU Center in Worcester for its April 28–May 1 conference and April 29 exhibition.

Okta says securing AI agents has become enterprises’ top identity concern, prompting the company to expand its governance and policy controls to manage non-human entities.

Taiwan’s flexible PCB makers are pursuing AI-driven opportunities in wearables, high-speed transmission and robotics.

Entries for Circuits Assembly's 2026 NPI Awards, recognizing innovations in electronics assembly equipment, material and software, are due Dec. 19.

TopLine Corp. offers zero ohm jumpers and dummy components.

Plasma Innovations’ Flexxal process enables aluminum conductor traces to be soldered like copper.

SMTA finalized the program for the 30th Pan Pacific Strategic Electronics Symposium, set for February 2–5 in Hawaii.

Shenmao Technology releases SMF-TA52 transient adhesive.

Vision Engineering releases ProteQ VISO 3D digital stereo microscope system.

PCB West 2026 will take place Sept. 29–Oct. 2 at the Santa Clara Convention Center, with booth registration now open for returning exhibitors.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

FOCUS ON BUSINESS
Revisiting the EMS-OEM Partnership
One trend in the electronics manufacturing services (EMS) industry that I don’t like is the commoditization of services. This isn’t new. It’s been going on for decades, but it has been getting worse. Part of the problem, I think, is that the EMS value proposition has gotten lost.

SUSAN MUCHA

Susan Mucha





















BUSINESS NEWS

China said it supports mutual benefit and cooperation with the US after Washington approved exports of Nvidia’s H200 AI chips to China.

A new report says Singapore, Malaysia, Vietnam and Thailand are rapidly moving up the global chip value chain, shifting from assembly roles to strategic hubs for advanced packaging, testing, and IC design as regional semiconductor investment accelerates.

President Trump said he will issue an executive order blocking state-level AI regulation, creating tension with Florida Gov. Ron DeSantis’ proposed AI Bill of Rights and raising questions about how federal and state authority will align on AI policy.

Foxconn will invest $170M to open a new electronics manufacturing plant in Louisville, KY.

November’s Electronic Component Trends and Sentiment report shows the index rising to 120.1, outperforming expectations and signaling broad optimism for the fourth quarter.

AI demand is lifting Taiwan’s IC distributors to record levels.

Tata Electronics and Intel signed an agreement to explore chip manufacturing, packaging, and AI PC development in India.

Marvell shares fell after reports that Microsoft and Amazon may shift key custom chip programs to competitors.

Coherix opened a new vision center in Sinsheim, Germany.

Entrepix named Legatech exclusive sales representative for the UK and Nordic region.

Helios Technologies promoted Billy Aldridge to president, electronics segment.

DATA TRANSFER
From One-Way Handoffs to True Bidirectional Design Data Exchange Using IPC-2581
For years, we talked about “handing off” design data to manufacturing partners. Many still do. The handoff model is simple: design sends “build intent” in one direction, usually through a mix of emails, spreadsheets, PowerPoints and Word documents.

HERMANT SHAH

Hemant Shah






















TECHNICAL ARTICLES

The Analysis of Variance: Drawing Conclusions from Data that are Correct, Unambiguous and Defensible
PCD&F/CIRCUITS ASSEMBLY


Multi-scale Alignment Detection Transformer for PCB Defect Detection with Enhanced Cross-scale Feature Fusion
Measurement Science and Technology


Electromigration in Eutectic Gold-Tin (80Au20Sn-wt%) Solder Joints
Journal of Electronic Materials


EVENTS

Jan. 21-23: 40th Internepcon JapanTokyo Big Sight, Japan
Feb. 2-5: Pan Pacific Strategic Electronics SymposiumHawaii
Feb. 3-4: EIPC Winter ConferenceAix-en-Provence/Marseille, France
Feb. 6, 13, 20, 27, Mar. 6: Certified Printed Circuit Design Training, Online
Feb. 17-19: Chiplet SummitSanta Clara, CA
Apr. 22-23: Del Mar Electronics ShowSan Diego, CA
Apr. 28-May 1: PCB East 2026Worcester, MA
May 26-29: IEEE Electronic Components and Technology ConferenceOrlando, FL
June 9-11: ZIW Americas 2026Dallas, TX
June 15-16: PCB Detroit 2026Detroit, MI
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 29-Oct. 2: PCB West 2026Santa Clara, CA


 

BOOK-TO-BILLS/MARKET TRENDS
             Oct. Trend
EMS 1.26 Down
Semiconductors         15.3% Up
PCBs 1.00 Up
Component Sales Sentiment 122.2 Up
Changes are year-over-year.    

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