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THE LEAD
Research into next-generation 6G wireless networks is beginning to define how future connectivity could handle faster data and AI-driven sensing. At the same time, Ukraine’s defense industry is moving to replace foreign drone components with domestically produced alternatives.
TECH NEWS
Next-generation 6G wireless networks are expected around 2030, focusing on faster upload speeds, AI-driven networking and sensing capabilities that allow networks to detect devices, vehicles and people.
Early bird registration for the PCB East 2026 technical conference ends March 27, ahead of the April 28–May 1 event in Worcester, MA.
Chip makers face a looming shortage of a key ingredient if the Iran conflict drags on.
How is AI transforming PCB inspection? Manufacturers are deploying computer vision systems to detect production defects.
Mike Buetow discusses Cadence’s acquisition of EMA Design Automation and what the deal could mean for the companies and the PCB design software market on the PCB Chat podcast.
Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.
PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.
PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.
CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.
Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.
PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.
Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.
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FOREFRONT
AI Data Center Packaging Challenges Highlighted at Nepcon Japan
With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, and more.
E. JAN VARDAMAN

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BUSINESS NEWS
The Taiwan Printed Circuit Association unveiled a risk governance strategy outlining six pathways aimed at strengthening resilience across the PCB supply chain.
Ukrainian defense technology companies are accelerating efforts to localize drone components, with some systems now using entirely domestically produced parts as the country works to reduce reliance on Chinese suppliers.
Samsung Display warned that rising oil prices linked to the Iran war could increase energy and material costs across the electronics supply chain.
Flexium Interconnect expects AI servers and smart glasses applications to generate about 30 percent of its revenue this year as demand grows for high-speed FPC interconnects.
Global tablet shipments declined 4 percent year-over-year in the fourth quarter as the market shifts toward a more mature, replacement-driven phase.
IDC has lowered its outlook for global PC shipments to a decline of 11.3 percent, versus a drop of 2.4 percent previously forecasted in November.
SQ Advanced Interconnect plans a Bursa Malaysia listing to support manufacturing expansion and R&D for flexible circuits and IC substrates.
Servatron will shut down its plant in Spokane Valley at the end of the year, according to its parent company, Volex.
Vipulse Technology is planning an advanced manufacturing production center in Hungary that will include SMT electronics manufacturing.
The server market reached a record $125B in revenue during the fourth quarter, fueled by the accelerated AI Infrastructure investment path, according to IDC.
Hanwha named FHP Reps representative in Texas, Oklahoma, Arkansas and Louisiana.
BTU International named Smartsol America as its representative for Texas.
RBB Systems and USA Firmware formed an engineering partnership.
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DESIGNER'S NOTEBOOK
Splitting a PCB for Concurrent Design
Printed circuit board design grows in complexity with each passing year. Many protocols must be implemented. An ASIC may be the center of attention, but there will likely be a memory bus along with other architectures, such as ethernet or USB, to move data around.
JOHN BURKHERT, JR.

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TECHNICAL ARTICLES
Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing
PCD&F/CIRCUITS ASSEMBLY
The 2025 AI Index: Documenting Sociotechnical Features of Deployed Agentic AI Systems
MIT
Flexible Electronics in Robotics Systems: From Devices to Applications
SmartBot
EVENTS
| Apr. 22-23: |
Del Mar Electronics Show, San Diego, CA |
| Apr. 28-May 1: |
PCB East 2026, Worcester, MA |
| May 15, 22, 29, June 5, 12: |
Certified Printed Circuit Design Training, Online |
| May 26-29: |
IEEE Electronic Components and Technology Conference, Orlando, FL |
| June 2-4: |
Fac Tec China 2026, Shanghai, China |
| June 9-10: |
EIPC Summer Conference, Lithuania |
| June 9-11: |
ZIW Americas 2026, Dallas, TX |
| June 15-16: |
PCB Detroit 2026, Detroit, MI |
| June 24-26: |
Vietnam Intcomm 2026 & Electronic Vietnam 2026, Ho Chi Minh City, Vietnam |
| Sept. 29-Oct. 2: |
PCB West 2026, Santa Clara, CA |
| Feb. 17-19, 2027: |
Nepcon Japan, Tokyo, Japan |
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| BOOK-TO-BILLS/MARKET TRENDS |
| |
Dec. |
Trend |
| EMS |
1.24 |
Up |
| Semiconductors |
25.6% |
Up |
| PCBs |
1.18 |
Up |
| Component Sales Sentiment |
120.1 |
Down |
| Changes are year-over-year. |
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Brought to you by the Printed Circuit Engineering Association
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ABOUT
PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.
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