Saying the trend of net zero is unstoppable, Taiwan’s Digital Transfer Institute of the Information Policy Council will introduce a PCB industry standard for carbon inventory.

Apple has scaled back ambitious self-driving plans for its future electric vehicle and postponed the car’s target launch date by about a year to 2026, according to people with knowledge of the matter.

Government and consumer pressure are forcing manufacturers to take on greater responsibility in reducing their emissions. A new research report from IDTechEx asserts that by embracing sustainable manufacturing methods, companies can benefit financially and demonstrate significant reductions in environmental impact.

The Printed Circuit Engineering Association (PCEA) seeks abstracts for its annual PCB West technical conference coming in 2023.

NextFlex announced $8.45 million in funding (including $4.25M in cost-share contribution from participants) for nine new projects as part of its Project Call 7.0 to further promote flexible hybrid electronics development and adoption throughout the US advanced manufacturing sector.

Zuken and Compound Semiconductor Applications Catapult announced a milestone in their R&D collaboration aimed at building a development environment for state-of-the-art compound semiconductor products.

HDP User Group’s Madan Jagernauth discusses the consortium’s latest programs, including ones on Pb-free manufacturing, on the PCB Chat podcast.

STPI inaugurated its Electropreneur Park-Bhubaneswar Electronics System Design & Manufacturing (ESDM) Lab facility at STPI ELITE, in Bhubaneswar, India.

Global semiconductor sales were $46.9 billion in October, down 0.3% from September and down 4.6% from last year.

TSMC plans to triple its US chip investment to $40 billion to serve Apple, among others, a win for Washington's semiconductor ambitions.

Ansys has entered into a definitive agreement to acquire the DYNAmore business from DYNAmore Holding, a provider of simulation solutions to the automotive industry.

ICAPE Group has acquired 100% of the shares in the Sweden-based MMAB Group.

Foxconn reported November sales fell 11.4% from the prior year after some shipments were affected by a Covid outbreak in the Chinese city of Zhengzhou, where the company operates the world’s largest iPhone assembly complex.

Foxconn's Covid-hit plant in Zhengzhou is expected to be back at full output in late December to early January, Reuters said.

A new report documenting “the automotive industry’s reliance on forced labor and other exploitation” in China’s Xinjiang Uyghur Autonomous Region could presage related enforcement actions against imports of automotive products and parts.

TTM Technologies and Raytheon Missiles & Defense have reached a multiyear, possibly $500 million agreement to provide radio frequency assemblies, electronic hardware, and printed circuit boards for the SPY-6 family of radars.

Eltek has received a follow-up purchase order in the amount of $1.1 million from an existing customer in the defense sector.

Tyvak Nano Satellite completed the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.

Thermaltronics appointed BRL Marketing Sales as rep in Illinois, Wisconsin, Kansas and Iowa.

ECD hired Michael Pliska as director of engineering.

Libra Industries appointed Nathan Whipple vice president of sales.

Scienscope hired George Fanut as European service engineer.

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.