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THE LEAD
Researchers have developed a noncontact method to monitor active semiconductor devices in real time, while air freight disruptions tied to Middle East conflict are delaying chip shipments to Europe and tightening supply.
TECH NEWS
An always-on computer vision system developed by Nvidia researchers can detect human faces in less than a millisecond.
Researchers have developed a terahertz-based technique to monitor active semiconductor devices in real time without physical contact or disruption.
NSF funding is supporting new ion mobility instruments using PCB-based platforms to enable controlled chemistry and advanced molecular analysis.
Count On Tools introduces Mydata Midas 2026-5652 for component placement.
CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.
Early bird registration for the PCB East 2026 technical conference ends March 27, ahead of the April 28–May 1 event in Worcester, MA.
Mike Buetow discusses Cadence’s acquisition of EMA Design Automation and what the deal could mean for the companies and the PCB design software market on the PCB Chat podcast.
Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.
PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.
PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.
CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.
Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.
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FOREFRONT
AI Data Center Packaging Challenges Highlighted at Nepcon Japan
With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, and more.
E. JAN VARDAMAN

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