PCB UPdate logo
facebook      twitter      linkedin      linkedin     
March 17th, 2026
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

The US Commerce Department withdrew a draft rule that would have replaced Biden-era restrictions on global access to advanced AI chips, while CIRCUITS ASSEMBLY announced the winners of its 2026 NPI Awards, honoring new electronics assembly equipment, materials and software introduced over the past year.

TECH NEWS

CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.

Researchers from NIMS and several Japanese universities demonstrated altermagnetism in ruthenium dioxide thin films, a magnetic property that could enable faster, more energy-efficient spintronic memory technologies and potentially improve future RAM and data-storage devices.

Thailand will return 284 metric tons of illegally imported electronic waste to the United States after authorities seized 12 containers of e-waste at Laem Chabang Port.

Researchers at KAIST and ETRI developed a liquid metal powder that enables electronic circuits to be drawn directly onto surfaces such as paper, fabric, plastic and glass, creating flexible conductive patterns through pressure without specialized manufacturing equipment.

Teradyne launched Omnyx, a manufacturing test platform that combines structural, parametric, high-speed interconnect and functional testing in one system.

Boardera Software launches API PCB project analyzer.

Siemens launches Fuse EDA AI Agent.

Early bird registration for the PCB East 2026 technical conference ends March 27, ahead of the April 28–May 1 event in Worcester, MA.

Mike Buetow discusses Cadence’s acquisition of EMA Design Automation and what the deal could mean for the companies and the PCB design software market on the PCB Chat podcast.

Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.

CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.

Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.

PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

FOREFRONT
AI Data Center Packaging Challenges Highlighted at Nepcon Japan
With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, and more.

E. JAN VARDAMAN

E. Jan Vardaman





















BUSINESS NEWS

The US Commerce Department has withdrawn a draft rule that would have replaced the Biden-era regulation governing global access to advanced AI chips.

Zhen Ding Technology said AI-related products are expected to account for nearly 70 percent of its revenue, as the PCB manufacturer plans $3.1B in expenditures over the next two years to expand capacity for AI servers.

Escalating Middle East tensions are increasing costs across the PCB supply chain, as disrupted shipping routes and higher energy prices drive up expenses for raw materials, manufacturing and logistics.

Samsung Electronics and LG Electronics are tightening cost controls as rising raw material and semiconductor prices increase manufacturing expenses, with Samsung’s procurement costs climbing 8.8 percent.

MicroCare appointed Dr. Uwe Wanner director of research and development.

DESIGNER'S NOTEBOOK
Splitting a PCB for Concurrent Design
Printed circuit board design grows in complexity with each passing year. Many protocols must be implemented. An ASIC may be the center of attention, but there will likely be a memory bus along with other architectures, such as ethernet or USB, to move data around.

JOHN BURKHERT, JR.

John Burkhert, Jr.






















TECHNICAL ARTICLES

Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing
PCD&F/CIRCUITS ASSEMBLY


The 2025 AI Index: Documenting Sociotechnical Features of Deployed Agentic AI Systems
MIT


Flexible Electronics in Robotics Systems: From Devices to Applications
SmartBot


EVENTS

Apr. 22-23: Del Mar Electronics ShowSan Diego, CA
Apr. 28-May 1: PCB East 2026Worcester, MA
May 15, 22, 29, June 5, 12: Certified Printed Circuit Design Training, Online
May 26-29: IEEE Electronic Components and Technology ConferenceOrlando, FL
June 2-4: Fac Tec China 2026Shanghai, China
June 9-10: EIPC Summer Conference, Lithuania
June 9-11: ZIW Americas 2026Dallas, TX
June 15-16: PCB Detroit 2026Detroit, MI
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 29-Oct. 2: PCB West 2026Santa Clara, CA
Feb. 17-19, 2027: Nepcon JapanTokyo, Japan


 

BOOK-TO-BILLS/MARKET TRENDS
             Dec. Trend
EMS 1.24 Up
Semiconductors         25.6% Up
PCBs 1.18 Up
Component Sales Sentiment 120.1 Down
Changes are year-over-year.    

Brought to you by the Printed Circuit Engineering Association
PCEA logo
ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend •  About     twitter  linkedin  linkedin

ISSN 1555-7936, Copyright© 2026 Printed Circuit Engineering Association®, PO Box 237 Portsmouth, NH 03802. All rights reserved.
This newsletter contains copyrighted material that cannot be reproduced without permission. Printed Circuit Engineering Association® Privacy Policy