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April 7th, 2020
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

Will Apple’s “Air Tags” be the next big thing in electronics?

The rise of the digital enterprise is creating an opportunity for organizations to radically rethink business models, operating processes and team structures. Research from McKinsey suggests two of the keys to successful digital transformation.

MIT researchers designed a blueprint for a device that could harvest terahertz radiation to enable self-powering portable electronics.

iNEMI will hold a webinar on the impact of mold compound flowability on quality and warpage in wafer/panel level packaging (WLP/PLP). The consortium’s recently completed Wafer/Panel Level Package Flowability and Warpage project focused on identifying and understanding the effect of the material factors and key process parameters important for achieving higher yield in flow and warpage control for mold first WLP/PLP assembly processes.

Schleuniger introduces CrimpCenter 64 SP automatic crimping machine.

Our April issue is now out! Highlights include articles on BGA impacts on PCB fabrication, cleaning and drying prior to conformal coating, understanding time and frequency domains, plus lots more!

SafeRFQ rolls out SafeRFQ.com RFQ exchange for EMS companies.

Looking for training on SMT assembly, or are you an engineer who needs to learn PCB design? Check out the upcoming PCB2Day workshops in Austin, TX, in June.

What leads to signal integrity issues in a PCB?

I Need a Stiffer Flex Circuit. What Do I Do?
Many different materials are used to rigidize flexible circuits. Likewise, the reasons for stiffening an area on a flex board are many. The “best” stiffener material is tied to exactly why you are stiffening your flex circuit.

Mark Finstad



South Korea is struggling to retain its lead in global next-generation 5G telecom services, as the coronavirus pandemic further cools sentiment of consumers whose interest in the technology has waned due to cost and quality concerns.

Manufacturing economic activity contracted in March, say the nation's supply executives, according to ISM.

How is the PCB industry responding to Covid-19? An update from the editors of PCD&F/CIRCUITS ASSEMBLY.

Samsung Electronics has suspended its home appliance factory in South Carolina after two of its workers tested positive for Covid-19, according to reports.

A Gartner survey of 317 CFOs and finance leaders revealed that 74% of organizations will move at least 5% of their previously onsite workforce to permanently remote positions post-Covid 19.

Manufacturing takes more of a beating in downturns than other sectors – and it’s still scarred from the last one.

Raytheon Intelligence & Space named Dan Smith ECAD specialist.

Vistesco Technologies named Stefana Buraga hardware PCB designer.

Ansys promoted Craig Hillman director of product management, new and emerging technologies.

New IPC Standards Emphasize Performance over Composition
5G is expected to revolutionize many aspects of work and life, as a critical enabler for connected cars and self-driving vehicles, autonomous factories, remote medical surgery and the diffusion of smart “things” throughout cities, infrastructures and our homes.

Alun Morgan



From the pages of
Common Design for Assembly ‘Gotchas’
DfM means design for money. If it can’t be built, that’s a waste.
by John Burkhert Jr.

From the pages of
Can Tomorrow’s A&D Designs Handle the Heat?
New 3-D technologies with robust interconnects and thermal solutions are on the way.
by Peter M. Carter


June 9-10: PCB2Day: SMT Assembly Boot Camp, Austin, TX
June 11-12: PCB2Day: Design Essentials for PCB Engineers, Austin, TX
June 17-19: Nepcon China, Shanghai, China
June 22-24: CPCA Show, Shanghai, China
July 3-5: Productronica China 2020, Shanghai, China
July 21-23: Semicon West, San Francisco, CA
Sept. 8-11: PCB West 2020, Santa Clara, CA
Sept. 27-Oct. 1: SMTA International 2020, Rosemont, IL


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           4/6/20 Trend
Sn $6.56 Up
Pb $0.78 Up
Ag $207.36 Up
Cu $2.21 Up
             Jan. Trend
Semi equip. billings 22.9% Up
ICs -0.3% Up
PCBs 1.05 Down
Computers/elec. products 5.43 Down

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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