Samsung reportedly shifts its memory strategy toward AI servers. Japan prepares to take an AI-powered robotics competition aboard the International Space Station. 

Japan plans to host an International Space Station competition in which teams use artificial intelligence to control a robot, aiming to cultivate the next generation of space engineers.

Researchers demonstrated that three bacterial strains can selectively recover copper, silver, iron, manganese and zinc from waste PCBs through a potentially more sustainable bioleaching process.

Promex shifts to fully automated PCB inspection.

SlightGen Solutions developed a homegrown robotic soldering system to give Indian PCB assemblers a locally supported alternative to imported equipment.

PVA releases DeltaFlex coating and dispensing platform.

Flexible Circuit Technologies announced the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.

Chinese memory chip giant Changxin Memory Technologies said it adopted its new-generation technology platform for mass production, narrowing the advantage of global leaders including Samsung Electronics and SK Hynix in manufacturing nodes.

An upcoming PCEA webinar will look at component availability, lifecycle risk, lead times and electronics supply chain challenges.

PCEA announced 11 free technical sessions and a keynote for PCB West 2026, covering topics including AI, PCB design, signal integrity, flex, UHDI, fabrication and assembly on Sept. 30 in Santa Clara, CA.

PCB West 2026 will feature a panel examining AI, interposers, high-speed and high-current design, and optical interconnects shaping PCB design through the end of the decade.

PCEA announced two fall webinars covering the role of the PCB designer and signal routing for controlling energy, signal integrity and EMI in digital PCBs.

PCB West 2026 will feature 11 presentations on electronics assembly processes, including a half-day solder paste qualification workshop and sessions covering SMT printing, stencil design, reflow soldering and more.

PCEA will host a 3.5-hour webinar on Nov. 4 led by Susy Webb covering signal routing techniques to improve signal integrity and EMI performance.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Samsung Electronics is reportedly preparing to outsource most consumer DRAM module production while shifting its internal capacity toward high-bandwidth memory and advanced packaging for AI servers.

TM Soldering Solutions opened a selective soldering process development lab at its Spokane Valley, WA, facility.

Delvitech plans to invest up to $30M in a new Bengaluru facility.

PCB wet-process equipment maker Ampoc Far-East said demand for its in-house high-end equipment has surged on AI servers and high-performance computing applications, driving brisk orders in the first half of 2026.

India’s government is focusing on the next stage of this growth by increasing domestic manufacturing of the components that go into electronic products.

Chinese chips are advancing despite being shut out of US technology.

AMC Robotics provides an update on Vietnam manufacturing facility buildout, targeting $30M annual capacity.

Aimtron's US arm reported $11M in orders.

AT&S and Marvell Technology are expanding collaboration for next-gen AI infrastructure.

Koh Young America appointed Brent Johnson Western regional sales manager.

Infineon Technologies (Wuxi) named Kevin Pelletier sustaining product engineer.

Claude Mythos and Project Glasswing: What OEMs Need to Know Now
PCD&F/CIRCUITS ASSEMBLY

Thermal Management in Electronics: From Conventional Cooling to Hybrid Innovations
Journal of Electronic Packaging

Vision-Based PCB Defect Detection Using YOLOv5 and MobileNetV2 with Grad-CAM
Proceedings of International Conference on Computational Intelligence

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.