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April 14th, 2024
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

A neural network microchip from China that uses photons instead of electrons, dubbed Taichi, can run AI tasks as well as its electronic counterparts with a thousandth as much energy, according to a new study.

PCBs made of glass substrates may be "the next big thing" in chip development, and Apple is rumored to be planning to adopt them.


Google and MIT have unveiled a free Google Generative AI Educators course to help middle and high school teachers use generative AI tools to enhance their workflow and students' classroom experience.

Panasonic rolled out NPM-GH pick-and-place machine.

SIA’s Workforce Policy Blueprint takes a holistic approach to solving the workforce challenges ahead by proposing policies that would meet the projected demand for workers.

Vishay launched new TVS series.

Meta and Google have both announced new AI chips, touting them as key to the development of their AI platforms and as alternatives to the Nvidia chips the tech industry has been relying on to power AI data centers.

ECIA announced a theme of “Navigating the Tides of Change” for its 2024 Executive Conference set for Oct. 20-22 in Chicago.

MKS released ESI Geode G2 laser system.

An adaptable pullup can be used in I2C systems where power is restricted or several chips with different I2C modes are used.

IDTechEx's newest report analyzes the technologies and market trends that promise to bring electronics into the 3-D realm.

Samtec released narrow body RF edge launch connectors.

PCB East 2024 features an all-day forum on UHDI: From Design to Manufacturing.

The 80/20 Rule
Since tax season is upon us, I recently had a chat with my CPA. She is co-owner of one of the largest accounting firms in my area and I've done business with her for over two decades, so we discuss business strategy in addition to going over the numbers.


Susan Mucha


NCAB Group reported annual revenue of KR4.12 billion ($377.9 million), down 7.5% from 2022.

Firan Technology Group announced first quarter sales of $35 million, a 42% increase over the first quarter of 2023.

Zetwerk has announced a Rs1,000 crore ($119.6 million) investment to ramp up its electronics manufacturing capacity.

Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to $106.3 billion in 2023 from an all-time record of $107.6 billion in 2022, SEMI reported.

Taiwan's PCB and IC substrate market will first stagnate before seeing a sharp increase in 2024, according to TPCA chairman Maurice Lee.

The worldwide copper foil market size is expected to from $7.41 billion in 2023 to $14.85 billion by 2033, according to a research report published by Spherical Insights & Consulting.

Kaynes Technology India saw a 162% surge in its share price in the past year.

Neither Foxconn nor Apple will seek a settlement in court with Qualcomm over the companies’ ongoing legal tug-of-war over patents.

Ellies, a JSE-listed electronics manufacturer and distributor, is being liquidated after business rescue efforts failed to bear fruit.

Chinese banks have reportedly begun blocking payments from Russian companies for electronic component purchases since late March.

China has banned the senior executives of two US defense companies from entering the country and frozen their property in response to their arms sales to Taiwan.

Nanya Technology announced a significant improvement in net losses in the first quarter of 2024 compared to the previous quarter and predicted a double-digit ASP rise in the second quarter.

Copper's bull run should continue for at least the next three years, fueled by global supply challenges and hot demand for the metal to power energy transition and artificial intelligence technologies, industry analysts say.

China’s push to replace foreign technology is now focused on cutting American chip makers out of the country’s telecommunications systems.

Toppan will build a new semiconductor packaging substrate factory in Singapore, with plans to put it into operation by the end of 2026.

Dixon Technologies has signed an agreement with Dassault Systèmes to transform its manufacturing landscape using the latter’s software.

Ducommun announced two awards totaling over $50 million in revenue for circuit assemblies for Raytheon’s SPY-6 family of radar systems.

Bransys purchased a Pillarhouse Jade MKII selective soldering system.

Designing for PCB Assembly
Printed circuit board assemblies animate a collection of components designed to do something useful. Joining those components on a board that completes the connections with a circuit pattern is the best solution we have to create modern electronic devices.


John Burkhert Jr.


Thermal Vias are Ineffective. Here’s Why.

PCB Defect Detection Algorithm Based on CDI-YOLO

End-To-End Material Thermal Conductivity Prediction Through Machine Learning
Journal of Applied Physics


April 24: Advanced Electronics Assembly ConferenceBudapest, Hungary
April 24-25: Del Mar Electronics & Manufacturing ShowSan Diego, CA
May 7-9: CTMA Partners MeetingProvidence, RI
May 9: Advanced Manufacturing Conference & Line TourCounty Clare, Ireland
May 14-16: Electronics in Harsh Environments ConferenceCopenhagen, Denmark
May 28-29: New-Tech Exhibition 2024Tel Aviv, Israel
May 28-30: Semicon Southeast Asia 2024Kuala Lumpur, Malaysia
May 28-31: Electronic Components and Technology ConferenceDenver, CO
June 4-7: PCB East 2024Boxborough, MA
June 10-12: PCBAA Annual ConferenceWashington DC
June 14: Printed Circuit Engineering Professional (CPCD) ClassOnline
June 18-20: 2024 SMCBA Conference & ElectroneX ExpoSydney, Australia
Oct. 8-11: PCB West 2024Santa Clara, CA


Email industry press releases or links to the editors of PCD&F/CIRCUITS ASSEMBLY: pr@pcea.net.


             Feb. Trend
EMS 1.22 Up
ICs16. 16.3% Up
PCBs 1.07 Up
Component Sales Sentiment 100.8% Up
Changes are year-over-year.    

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.

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