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THE LEAD
The US Commerce Department withdrew a draft rule that would have replaced Biden-era restrictions on global access to advanced AI chips, while CIRCUITS ASSEMBLY announced the winners of its 2026 NPI Awards, honoring new electronics assembly equipment, materials and software introduced over the past year.
TECH NEWS
CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.
Researchers from NIMS and several Japanese universities demonstrated altermagnetism in ruthenium dioxide thin films, a magnetic property that could enable faster, more energy-efficient spintronic memory technologies and potentially improve future RAM and data-storage devices.
Thailand will return 284 metric tons of illegally imported electronic waste to the United States after authorities seized 12 containers of e-waste at Laem Chabang Port.
Researchers at KAIST and ETRI developed a liquid metal powder that enables electronic circuits to be drawn directly onto surfaces such as paper, fabric, plastic and glass, creating flexible conductive patterns through pressure without specialized manufacturing equipment.
Teradyne launched Omnyx, a manufacturing test platform that combines structural, parametric, high-speed interconnect and functional testing in one system.
Boardera Software launches API PCB project analyzer.
Siemens launches Fuse EDA AI Agent.
Early bird registration for the PCB East 2026 technical conference ends March 27, ahead of the April 28–May 1 event in Worcester, MA.
Mike Buetow discusses Cadence’s acquisition of EMA Design Automation and what the deal could mean for the companies and the PCB design software market on the PCB Chat podcast.
Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.
PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.
PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.
CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.
Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.
PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.
Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.
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FOREFRONT
AI Data Center Packaging Challenges Highlighted at Nepcon Japan
With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, and more.
E. JAN VARDAMAN

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