Foxconn is ramping up HD PCB capacity with a new Huai’an campus as Siemens invests roughly $70M to scale production in Mexico.

imec outlined a roadmap extending to 0.2nm-class chips, highlighting a shift toward 3-D scaling, new materials and advanced interconnects to sustain performance gains.

Fanuc introduces CRX-3iA Collaborative robot for high-mix assembly.

Littelfuse/C&K introduces TDB series surface-mount DIP switches.

Nemanja Jokanovic discusses automating BoM management, outlining sourcing challenges and how AI-driven tools optimize analysis and supply chain decisions in the PCB Chat podcast.

PCEA and the SMTA Capital Chapter are sponsoring a webinar, “Design for Sourcing,” presented by supply chain expert Ed Dodd of Cofactr, starting at 1 p.m. EDT on May 5.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

Registration for CIRCUITS ASSEMBLY 2026 Service Excellence Awards for EMS providers and suppliers ends on April 30.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Foxconn broke ground on a new Huai’an HD campus, with Zhongji Innolight’s chairman attending in support.

Siemens will invest roughly $70M to scale production in Mexico. to expand production capacity in Querétaro.

A new study found semiconductor firms with revenue surpassing 50 trillion won and net profit surging nearly 400 percent on strong AI-driven demand.

SK hynix reported record first quarter results, rose 17.6 percent in February, while bookings declined year-over-year.

Kitron plans a new 7,300m² facility in Sweden to expand capacity.

Mycronic posted record first quarter results and raised its 2026 outlook, citing strong AI-driven demand across key segments.

Siemens expanded its collaboration with TSMC to advance AI-driven automation across semiconductor design workflows.

Yihao New Materials reported 2025 revenue growth to 1.72 billion yuan, while net losses widened amid declining profitability.

SWEP partnered with Microchannel Devices to expand its portfolio with printed circuit heat exchangers.

Flex and Teradyne Robotics expanded their partnership to scale intelligent automation.

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Three-dimensional Printing of Nanomaterials-based Electronics with a Metamaterial-inspired Near-field Electromagnetic Structure
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EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.