Entries are open for the 20th annual Circuits Assembly NPI awards recognizing the year's top new electronics assembly equipment, materials and software products. Supply constraints are expected to ease in the second half of 2027 as production growth outpaces demand following shortages driven by AI infrastructure expansion.

Is a new wearable device from researchers at Georgia Tech and Seoul National University (SNU) the solution to a safer, more sleep-friendly night?

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

AJ Cooper joins PCB Chat to discuss Itera's self-rewiring "fluid" PCB technology and how it could eliminate costly design respins by enabling hardware to be updated after manufacturing.

Altus Group adds LPKF CuttingMaster 3290 laser depaneling system.

Stackpole Electronics expands RMCA series automotive grade chip resistors.

Hirose launches BK35 hybrid FPC-to-board connector.

PCEA has opened PCB East 2027 booth sales for returning exhibitors and Gold and Platinum corporate members. The exhibition will be held April 28, 2027, at the DCU Center in Worcester, MA, alongside the four-day technical conference, with general booth sales opening Aug. 12.

PCB West 2026 is nearly sold out, with fewer than 5 percent of exhibition booths remaining for the Sept. 29–Oct. 2 event at the Santa Clara Convention Center.

PCD&F has opened its 2026 PCB Designer Salary Survey, inviting PCB designers, design engineers and layout specialists to share information on salaries, job responsibilities, experience, education and more. Responses will be accepted through July 31.

PCEA announced a dedicated electronics assembly program for PCB West 2026, featuring 10 technical sessions on solder paste, placement, reflow, stencil design and cleaning.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

The NAND flash market will shift from a 4 percent to 5 percent supply deficit in 2026 to a supply surplus in the second half of 2027 as production growth outpaces demand.

TE Connectivity has agreed to acquire Astrodyne TDI.

US automakers are accelerating efforts to replace Chinese-made connected-car hardware with domestic alternatives as federal restrictions on Chinese vehicle connectivity components approach.

Samsung Electronics has created a dedicated robotics division to lead its strategy as the company accelerates commercialization of humanoid and industrial robots.

SEL has started site preparation for a $50M electronics manufacturing facility in Idaho.

Nvidia is positioning itself to supply every major chip inside AI data centers, expanding beyond GPUs with its new Vera Rubin CPU-GPU platform.

Nano Dimension has agreed to a board overhaul, prompting the departures of CEO Dave Stehlin and chairman Robert Pons.

Keiron Printing Technologies has raised $24M to expand production of its digital Lift solder paste printing platform.

Kurtz Ersa appointed E-tronix sales representative for Illinois and Wisconsin.

Reflow AI – Before There was Artificial Intelligence
PCD&F/CIRCUITS ASSEMBLY

AI-Enabled RFIC
2026 IEEE Custom Integrated Circuits Conference (CICC)

I Met With China’s Top AI Experts. They’re Freaking Out, Too
Wired

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.