The rhetoric by China over US Speaker Nancy Pelosi’s visit to Taiwan could be a cause of concern as Tamil Nadu, India, is becoming an alternative destination for investments from Taiwan following Covid-19, according to a top government official.

InnovationLab said it has achieved a breakthrough in additive manufacturing of printed circuit boards, helping meet higher environmental standards for electronics production while also reducing costs.

The National Institute of Standards and Technology is concerned about the threat quantum computing poses to current cryptographic standards, and it’s recruiting the best minds in the industry to develop defensive tools to stay ahead of the threat.

China’s push towards semiconductor self-sufficiency could face another big setback if the US expands export controls to design software for a piece of technology considered key to the next generation of chip development, according to analysts.

Google is reportedly switching to ceramics as the primary material for its future Pixel phones.

Harry Kennedy Jr. will give a free webinar on EMI/EMC on August 11.

The PCEA Conferences Task Group announced the technical program for PCB West 2022, featuring nearly 50 presentations and more than 110 hours of in-depth electronics engineering training.

DownStream Technologies will host a webinar on PCB design analysis, verification and optimization on Aug. 30.

Researchers at the University of Massachusetts and Georgia Tech have 3D-printed a dual-phase, nano-structured, high-entropy alloy that exceeds the strength and ductility of other state-of-the-art additively manufactured materials – which could lead to higher-performance components for applications in aerospace, medicine, energy, and transportation.

The IC market recorded its first-ever June sequential sales decline this year, based on data from WEMA, SIA, and WSTS dating back to 1976.

Scanfil reported second quarter sales rose 23.2% year-over-year to EUR 212.9 million ($217 million).

Integrated Micro-Electronics Inc. posted $357 million in revenue in the second quarter, up 7% sequentially and 12% year to date.

The Printed Circuit Engineering Association opened the show floor sales to exhibitors for next year’s PCB East conference and exhibition.

Altair reported second quarter software product revenue of $116.9 million, up 17.4% from a year ago.

Egypt has signed a cooperation agreement with Nokia and EAI Factory for Advanced Industries to produce Nokia phones in Egypt.

The head of China’s largest state-backed semiconductor investment fund is under investigation, the country’s corruption watchdog said.

The decline in consumer DRAM prices is becoming sharper as mounting inventory pressure compels suppliers to cut prices aggressively, Trendforce says.

Inventec and Quanta are expected to post sales increases in the second half despite market observers' anticipation of a particularly weak second half of the year for the notebook market, according to industry sources.

PK Sound, the robotic line array company, is now fully operational in its new 50,000 sq. ft. headquarters and electronics manufacturing facility in Alberta, Canada.

Pegatron has denied media reports alleging shipments to and from Chinese factory sites are being held for scrutiny by Chinese customs officials after company officials met with US House Speaker Nancy Pelosi.

Foxconn will build the Google Pixel Fold and Pixel 7 series.

Thailand's investment agency approved a joint venture worth 36.1 billion baht ($1.04 billion) between Foxconn and PTT to produce batteries for electric vehicles.

KMC Controls invested in an Ersa Versaflow 335 selective soldering machine.

Data Device purchased a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.

Ivor Langston, 95, founder of Fine Line Circuits, has passed away.

Dr. Jennie Hwang has been appointed chairman of tje Laboratory Assessment Board of The National Academies of Sciences, Engineering, and Medicine.

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Strong Yet Ductile Nanolamellar High-entropy Alloys by Additive Manufacturing
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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.