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November 21st, 2019
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
TECH NEWS

SEMI has developed “SEMI SMT-ELS (Equipment Link Standards),” the Standard suite for SMT assembly lines, which replaces SMEMA and adds data communication capabilities to make assembly lines smarter.

DownStream Technologies will host webinars on preparing designs for fabrication and best practices in PCB documentation on Thursday.

MacDermid Alpha offers MultiPrep 200 copper surface treatment.

LPKF shows Microcut 6080 stencil cutter.

MATERIAL MATTERS
Why You Should Quit Using 1080 Glass
Since June, I’ve been writing about glass-weave skew (GWS). If you haven’t read those articles, you may want to go back and bone up on the subject. We’ll review a few points here.
BILL HARGIN

Bill Hargin

 





















BUSINESS NEWS

Global electronic equipment sales increased an estimated 0.3% in the third quarter, based on a combination of company financial reports, individual company projections and estimates.

The memory industry is expected to recover in 2020, thanks to momentum from 5G-driven demand.

North American-based manufacturers of semiconductor equipment posted $2.11 billion in billings worldwide in October, up 3.9% year-over-year.

Registration for CIRCUIT ASSEMBLY's 2020 NPI Awards is open until Dec. 6.

East West Manufacturing, a design, manufacturing and distribution company, has acquired Adcotron EMS for an undisclosed sum.

Wearable technology continues to gather pace, building an ecosystem of connected devices and capturing consumer attention to the tune of $108 billion by 2023, according to Futuresource Consulting.

Cisco sued three former senior employees whom it accused of stealing thousands of files containing confidential information when they defected to a competitor.

TopLine announced expanded collaboration and technical cooperation with VPT Components, to provide CCGA column attachment services.

Accucode purchased a Nano Dimension DragonFly LDM additive manufacturing system, its second.

Foxconn founder Terry Gou is now reportedly considering a 2024 bid for the presidency of Taiwan.

ACL Staticide appointed Dan Kaiser national sales manager.

IPC named Alison James senior director, Europe.

Michael Joseph Connolly, former superintendent of printer and card manufacturing at IBM and vice president at SCI, has passed away.

GETTING LEAN
Thinking Lean in Test Strategy
While Lean manufacturing strategy is discussed in relation to test strategy, it often focuses on defect mitigation strategies such as integrating program, pack and test activities to minimize variation and transport.
ANDREW VO

Andrew Vo

 






















TECHNICAL ARTICLES

From the pages of
PRINTED CIRCUIT DESIGN & FAB:
Transparent Flexible Circuits
Wearable device manufacturers are pursuing the possibility of elastic, transparent and heat-resistant flexible circuits. At face value, it looks almost impossible to satisfy all the requirements. However, one of our affiliated companies developed silicone rubber-based flexible circuits using screen-printable silver inks.
by Dominique Numakura


From the pages of
CIRCUITS ASSEMBLY:
Comparison of Aperture Designs, Solder Pastes, Nanocoatings and Print/Inspection Systems
Testing transfer efficiency and repeatability for microminiature devices down to 01005 discretes and 0.4mm BGAs.
by Chrys Shea, Jennifer Fijalkowski, Raymond Whittier, Michael Butler, Edward Nauss and Dean Fiato

EVENTS

Dec. 4-6: HKPCA International Electronics Circuit Exhibition, Shenzhen, China
Jan. 28–30: DesignCon, Santa Clara, CA
Feb. 4-6: IPC Apex Expo 2020, San Diego, CA
Feb. 10-13: Pan Pacific Microelectronics Symposium, The Big Island of Hawaii
Mar. 24-25: PCB2Day: SMT Assembly Boot Camp, Austin, TX
Mar. 26-27: PCB2Day: Design Essentials for PCB Engineers, Austin, TX
Apr. 27-30: Zuken Innovation World Americas 2020, Coronado, CA


SUBMISSIONS

Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

METALS PRICES
           11/18/19 TREND
Sn $7.42 Down
Pb $0.93 Down
Ag $246.59 Down
Cu $2.64 Down
     
 
BOOK-TO-BILLS
             Sept. TREND
Semi equip. billings -6% Up
ICs -14.6% Up
PCBs 1.04 Up
Computers/elec. products 5.52 Up
     
ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.


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