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January 18th, 2021
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

LG Electronics has unveiled the world’s first rollable smartphone at CES, the world’s biggest consumer electronics and technology expo, leading the competition for the next display form factor in the handset market, following the success of Samsung Electronics’ foldable smartphones.

Xiaomi has been added to a US blacklist that will restrict American investment into the company, as the outgoing Trump administration ratchets up tension with Beijing by intensifying its crackdown on Chinese corporate interests.


What’s the difference between EMF and voltage? A closer look at the issue.

Automakers around the world are shutting assembly lines because of a global shortage of semiconductors that in some cases has been exacerbated by the Trump administration’s actions against key Chinese chip factories, industry officials said.

Tomsk State University (TSU) researchers, with colleagues from the Institute of High Current Electronics (IHCE) of the Russian Academy of Sciences, have developed a monomeric coating that can protect electronics equipment from rust and changes in temperature of -196° to +130°C.

TPCA identified five key developments that will continue to affect the PCB industry and subsequent development trends.

Ucamco will include an industrialized IPC-DPMX import in its upcoming Integr8tor and UcamX releases.

UP Media Group seeks abstracts for the PCB West technical conference.

Wired declared these 12 products to be the best things they saw at this year’s virtual CES consumer tech showcase.

Eric Fossum, inventor of the CMOS image sensor, talks to Mike Konrad on the Reliability Matters podcast.

There are several tried and true techniques for reducing EMC in isolated systems, and many come with no additional cost.

Have a new product to brag about? Register for CIRCUITS ASSEMBLY’s New Product Introduction Awards 2021.

Today’s Best Technologies are the Roadmap to an Even Better Future
2020 has been an unusual and challenging year, although many of us can be thankful for the resilience of high-tech industries. Indeed, activity has surged in some sectors, and generally the outlook is relatively buoyant.

Alun Morgan



The output of Taiwan's PCB industry grew 5.6% on year to a record high of NT$667.2 billion (US$23.83 billion) in 2020, bolstered by a pandemic-induced stay-at-home economy most of the year, as well as robust shipments for new iPhones and automotive.

A new report says Apple may struggle to find an alternative supplier to Wistron in India following a riot at one of its plants.

A Swedish court has dismissed an appeal by Huawei against its exclusion from the country’s 5G network rollout, paving the way for the 5G spectrum auction scheduled for next week to proceed as planned.

Tata Group plans to invest in digital, high-end electronics and healthcare in a post-pandemic world, the $100 billion conglomerate’s chairman said.

Continental plans to open a $170 million auto electronics factory in northern Serbia.

Yangtze Memory Technologies plans to double its output this year and start producing advanced NAND chips that can rival those from Samsung and other global leaders, Nikkei Asia has learned.

Incarcerated workers are making components like wire harnesses for BAE Systems – and only keeping a fraction of their paychecks.

Sono-Tek said fiscal third quarter sales were $3.83 million, up 4.2% from a year ago.

Memsense named Tino Gonzales manufacturing manager.

Anwarson Advanced Research Projects Laboratory named Hassan Shahzad chief technology officer.

Optimizing Design for Manufacturability Analysis
Two core tenets of Lean manufacturing philosophy are eliminating defect opportunities and minimizing process variation. Consequently, most companies embracing Lean principles do some form of design for manufacturability (DfM) analysis to identify manufacturability issues either during design or in the new product introduction phase.

Hom-Ming Chang



Chiplet Implementation via Virtual Prototyping

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength
Journal of Electronic Materials

New Coating Will Protect Electronics at Extreme Temperatures
Tomsk State University


Jan. 20-22: Nepcon Japan, Tokyo, Japan and Online
Mar. 8-12: IPC Apex Expo 2021, Online
May 10-12: PCB East 2021, Marlborough, MA
Aug. 16-18: DesignCon, San Jose, CA
Aug. 31-Sept. 3: PCB West 2021, Santa Clara, CA


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           1/11/21 Trend
Sn $9.71 Up
Pb $0.92 Up
Ag $391.76 Up
Cu $3.64 Up
             Nov. Trend
Semi equip. billings 23.1% Down
ICs 6.95% Up
PCBs 1.05 Up
Computers/elec. products 5.12 Up

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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