When an international team of researchers set out to create an “AI scientist” to handle the whole scientific process, they ended up with an AI tool that they judged equivalent to an early Ph.D. student.

Inside Google’s seven-year mission to give AI a robot body.

Opinions vary widely on why AI for EDA IP chip design is not ready for prime time, from evolving standards, IP security, geopolitics and robust manufacturing and packaging.

Electronics design software architect Charles Pfeil will keynote the PCB West conference and exhibition, which takes place in Santa Clara, CA, on Oct. 8-11.

The White House announced a new task force to deal with the growing needs of AI infrastructure after a meeting between senior US officials and top technology and power company executives.

A recent study reveals why Americans should remain optimistic about the future of the EV charging infrastructure and the role electronics play in enabling widespread expansion.

A new IDTechEx report examines the impact of automation on additive manufacturing.

A design tip for turning a digital multimeter into a simple but precise thermometer delivering exactly 1 mV/°C with a 0.1°C margin of error.

Flex published its 2024 sustainability report, highlighting the company's global sustainability performance and progress from 2023.

Note will build a new factory in Lund, Sweden, to meet a projected increase in demand in coming years.

Doosan has opened a flexible copper-clad laminate (FCCL) plant at the Horizon Industrial Complex in Gimje, Korea.

A joint venture between Foxconn and HCL Group has secured 30 acres of land in Noida, India, to set up a semiconductor outsourced assembly and testing (OSAT) unit.

Some 211,033 tech company employees have been laid off across more than 194 tech companies worldwide since the start of the year, with Dell, Intel, and Tesla leading the cuts, says a report from BestBrokers.

The US is partnering with India and its Semiconductor Mission (ISM) to grow and diversify global chip supply chains.

Padget Electronics, a subsidiary of Dixon Technologies, has signed an MoU with Asus to manufacture notebooks in India.

Orient Semiconductor Electronics is experiencing strong demand for AI servers and is expected to receive increased orders from memory module manufacturer Kingston Technology.

Circuit Technology Center installed four Hentec-Odyssey 1325 robotic hot solder dip machines.

Scanfil announced the approval of its near-term science-based targets by the Science Based Targets initiative (SBTi).

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