The US ordered equipment firms to stop select shipments to a major Chinese chipmaker, tightening semiconductor curbs. A newly developed roll-to-roll method enables continuous production of large-area flexible circuit boards, improving scalability.

A Korea Institute of Machinery and Materials team developed a roll-to-roll process enabling continuous production of large-area flexible circuit boards, improving scalability over traditional batch methods.

Schmid introduces Any Layer ET (Embedded Trace) Process.

MicroDETR improves PCB defect detection with a 5.1 percent mAP gain while reducing parameters by 15.21 percent and enabling real-time edge deployment.

Stackpole Electronics expands HCC bus bar shunt resistor series.

Tagarno relaunches FHD microscope line with camera upgrade and portfolio changes.

Nemanja Jokanovic discusses automating BoM management, outlining sourcing challenges and how AI-driven tools optimize analysis and supply chain decisions in the PCB Chat podcast.

PCEA and the SMTA Capital Chapter are sponsoring a webinar, “Design for Sourcing,” presented by supply chain expert Ed Dodd of Cofactr, starting at 1 p.m. EDT on May 5.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

Registration for CIRCUITS ASSEMBLY 2026 Service Excellence Awards for EMS providers and suppliers ends Monday.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

TTM reported net sales were $846M in the March quarter, up 30% year on year, and an all-time quarterly record.

Samsung Electro-Mechanics posted first-quarter operating profit of $189M, up 40 percent from a year earlier and well above analysts’ expectations, on demand for high-end semiconductor substrates used in AI accelerators.

A US Defense Department spokesman says the Revolutionary Federal Acquisition Regulation Overhaul will reduce regulatory burdens on industry.

The US ordered chip equipment firms to halt some shipments to Hua Hong, tightening curbs on China’s advanced semiconductor production.

Global silicon wafer shipments rose 13 percent year-over-year to 3.28B square inches in the first quarter.

Plexus reported $1.1B in second-quarter revenue, up 19 percent year over year.

LG Electronics and Nvidia are in talks to collaborate on robotics, AI data centers, and mobility initiatives.

Samsung reported record results, rising more than 750 percent year over year as AI-driven memory demand lifted pricing.

Axoft raised $55M in an oversubscribed Series A to advance implantable brain-computer interfaces.

Benchmark reported $677M in first-quarter revenue, up about 7 percent year over year.

Tata Electronics has overtaken Foxconn to become Apple’s biggest contract manufacturer in the country by headcount.

Teradyne reported first-quarter revenue of $1.2B, beating estimates, as AI-related demand drove record results and year-over-year growth.

Doosan will invest $135M in a new manufacturing base in Thailand for manufacturing copper-clad laminates.

PI Advanced Materials said it achieved both improved profitability and a more stable financial structure in the first quarter, driven by a higher share of products with flexible printed circuit boards.

Express Manufacturing added a second TRI 3D AXI.

Gowin Semiconductor and JLCPCB will collaborate to offer access to FPGA devices for prototype developers.

Reflow AI – Before There was Artificial Intelligence
PCD&F/CIRCUITS ASSEMBLY

Scalable Roll-to-Roll Approach for Encapsulating Long-Length Flexible Printed Circuit Boards
ACS Applied Materials & Interfaces

Three-dimensional Printing of Nanomaterials-based Electronics with a Metamaterial-inspired Near-field Electromagnetic Structure
Science Advances

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.