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May 19th, 2026
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

Amazon accelerates massive AI infrastructure investments spanning data centers, custom chips and next-generation networking. PCB East 2027 preparations are underway as PCEA opens its call for abstracts.

TECH NEWS

University of Maryland researchers developed a low-temperature copper printing process that produces corrosion-resistant electronic circuits without vacuum equipment.

PCEA issued a call for abstracts for PCB East 2027, seeking technical presentations on PCB design, fabrication, assembly, test, packaging and additive manufacturing ahead of the April event in Worcester.

Purdue’s IEEE student organization is expanding hands-on engineering opportunities in Indianapolis through PCB design projects, soldering workshops and industry-focused electronics competitions.

Researchers developed a scalable patterning method for creating atomically sharp two-dimensional metal-semiconductor junctions aimed at improving power-efficient logic-in-memory computing architectures.

Registration is open for PCB West 2026, which will feature more than 120 hours of PCB design and assembly training this September in Santa Clara.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

THE ROUTE
Is It Time to Retire the Roundtable?
Having returned from the IPC Apex trade show and listening to comments from stakeholders who are charged for volunteering their time to develop standards, one wonders if there is a better way.

MIKE BUETOW

Mike Buetow





















BUSINESS NEWS

A Samsung adviser warned the AI memory chip boom could slow by 2028 as Chinese chipmakers rapidly expand DRAM and NAND production capacity and global AI spending growth moderates.

Amazon CEO Andy Jassy is accelerating the company’s AI infrastructure expansion with major investments in data centers, custom AI chips, networking hardware and partnerships with OpenAI and Anthropic.

An NPR report highlighted Shenzhen’s SEG Electronics market as a major global sourcing hub where buyers procure components ranging from circuit boards and memory to motors, cameras and drones.

South Korea said it will pursue all options, including emergency arbitration, to prevent a potential Samsung Electronics strike as renewed labor talks continue over pay and bonus disputes.

Eltek reported a net loss of $2.9M on an 18% revenue drop for the quarter ended Mar. 31.

A California jury rejected Elon Musk’s lawsuit against OpenAI, ruling the claims were filed too late and clearing the company, Sam Altman, Greg Brockman and Microsoft of liability.

Google partnered with Blackstone on a new AI infrastructure venture that could invest up to $25B in data centers, cloud capacity and TPU-powered compute services.

Javad EMS installed four new Nordson SQ3000 AOI systems.

Scanfil expanded its manufacturing partnership with Bruker AXS.

Ubersmt installed a Heller MK7 reflow oven.

Cyient DLM appointed Ramakanth Alapati president and chief strategy and growth officer.

ROI
When AI Becomes a Security Risk Inside the Organization
Security has become a major issue for the industry over the past couple decades. Long gone are the times when information could be shared without concern that it would be intercepted, copied or stolen during the course of “normal” operations.

PETER BIGELOW

Peter Bigelow






















TECHNICAL ARTICLES

Reflow AI – Before There was Artificial Intelligence
PCD&F/CIRCUITS ASSEMBLY


An Electrically Conducting Water-based Reversible Adhesive
Advanced Electronic Materials


Simulation of Electrothermal Transient Responses in Power PCB Modules Using Comsol, Spice, and Asonika-TM
Russian Microelectronics


EVENTS

May 15, 22, 29, June 5, 12: Certified Printed Circuit Design Training, Online
May 26-29: Electronic Components and Technology Conference
Orlando
June 2-4: Fac Tec China 2026Shanghai
June 9-10: EIPC Summer Conference, Lithuania
June 9-11: ZIW Americas 2026Dallas
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 4, 11, 18, 25, Oct. 9: Certified Printed Circuit Design Training Online
Sept. 28-Oct. 2: Certified Printed Circuit Design Training, Santa Clara, CA
Sept. 29-Oct. 2: PCB West 2026Santa Clara, CA
Oct. 16, 23, 30, Nov. 6, 13: Certified Printed Circuit Design Training, Online
Feb. 17-19, 2027: Nepcon JapanTokyo


 

BOOK-TO-BILLS/MARKET TRENDS
             Feb. Trend
EMS 1.32 Up
Semiconductors         62% Up
PCBs 1.08 Down
Component Sales Sentiment 139.7 Up
Changes are year-over-year.    

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ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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