The US Department of War launched agreements with several OEMs to rapidly scale low-cost missile and hypersonic weapons production. Celestica became the latest EMS to announce a major new campus in Texas.

Growing AI data center deployments are increasing demand for advanced PCB technologies as faster AI servers require higher-speed networking infrastructure and improved inter-server communication performance.

TechSearch International reported growing shortages of advanced build-up substrates for AI, server and networking packages as increasing layer counts and larger substrate sizes strain industry capacity.

Specialty Coating Systems will host a webinar on May 21 on ultra-thin parylene and hybrid multilayer coatings combining parylene and ALD technologies.

Newcastle University engineers have developed a “reversible” glue as a sustainable alternative to permanent joining methods such as solder.

Registration is open for PCB West 2026, which will feature more than 120 hours of PCB design and assembly training this September in Santa Clara.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Celestica will invest $876M in a Fort Worth manufacturing campus focused on AI infrastructure hardware, creating nearly 2,000 jobs.

The US Department of War launched new agreements with Anduril, Leidos, CoAspire, Zone 5 and Castelion to scale low-cost missile production, targeting more than 10,000 cruise missiles and expanded hypersonic weapons output over the next several years.

SIIX reported a 2 percent year-over-year rise in first-quarter net sales for the period ended Mar. 31.

Semiconductors are leading a new phase of the AI boom, with strong chipmaker revenue growth and continued demand for AI hardware driving gains beyond the largest technology companies.

Nan Ya PCB's push into advanced IC substrates could influence global AI hardware supply chains by increasing capacity for high-performance GPUs, switches, and edge AI devices.

UMC Electronics saw sales and profits fall 15 percent and 44 percent, respectively, in its fiscal year ended Mar. 31.

Growing concern over US dependence on Chinese rare earth supplies is increasing attention on recovering valuable magnets and materials from domestic electronic waste to support electronics, defense and AI-related industries.

A Broadcom executive warned that TSMC is nearing production capacity limits as AI demand strains semiconductor supply chains.

Busan Equity Partners is renewing its bid for flex CCL maker Nexflex.

VJ Electronix appointed MaRC Technologies manufacturers’ representative in the Pacific Northwest.

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EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.