University of Washington researchers have developed a new PCB that performs on par with traditional materials and can be recycled repeatedly with negligible material loss.

North American PCB shipments in March were down 23.8% compared to March 2023, IPC reported in findings from its North American PCB Statistical Program.

EMA Design Automation will host a free webinar, MCADX – Next Generation MCAD/ECAD for SOLIDWORKS, on May 14 at 2 p.m. ET.

Vishay launched automotive grade inductor.

SIA will host a free webinar, Powering the Future: How Semiconductor Innovation Drives Greater Energy Efficiency and Productivity, on May 2.

The discounted price for the PCB East 2024 technical conference ends May 3.

Researchers at Linköping University in Sweden have synthesized the first free-standing single layer of gold atoms, dubbed “goldene,” which they say could play a pivotal role in the development of next-generation electronic components.

Talks on supply chain-driven circuit design and embedded inductor technology highlight the PCEA Boston Chapter meeting on May 2 in Lowell, MA.

PCB East 2024 features more than 80 hours of technical presentations, including an all-day forum on UHDI.

TSMC detailed its semiconductor technology and chip-packaging technology road maps at last week’s North American Technology Symposium.

A teardown of Avaya’s Huddle HC010 webcam provides an up-close look at a lockdown commodity.

Sanmina reported revenue of $1.83 billion for the second quarter of its fiscal year, a decrease of 21.1 % from the same quarter in 2023.

ITW announced $696 million in Test & Measurement and Electronics revenue for the first quarter, a decrease of 0.9% from 2023's first quarter.

Kinwong Electronic saw revenue of CNY10.8 billion in 2023 ($1.49 billion), up 2.3% from 2022.

North American EMS shipments in March were down 4% compared to the same month last year, according to IPC's North American EMS Statistical Program.

SK Hynix plans to invest more than KRW20 trillion ($14.6 billion) in a new fab in South Korea.

Leading Taiwanese technology firms are looking at relocating their manufacturing bases to India to bring down their exposure to the Chinese market, top policymakers in the Taiwan government have said.

Flexium Interconnect has expressed optimism about demand for automotive applications in the long run, believing the worst has passed.

Samsung Electronics reported a 10-fold increase in operating profit for the last quarter as the expansion of artificial intelligence technologies drives a rebound in the markets for computer memory chips.

Microsoft will invest $1.7 billion over the next four years in new cloud and AI infrastructure in Indonesia – the single largest investment in Microsoft’s 29-year history in the country.

Apple has unveiled ambitious plans to construct approximately 78,000 homes for its employees in India.

A new report shows what happens when Apple and Foxconn leave an area that was traditionally propped up by iPhone production and the employment it brought.

The Australian government has pledged approximately A$940 million ($617 million) to PsiQuantum, a quantum computing start-up company based in Silicon Valley.

Air Products and Chemicals announced that a world-leading PCB and contract manufacturer in China has awarded it another long-term onsite supply contract.

BAE Systems received a $12 million DARPA contract to develop enabling technologies for computer-aided battle planning.

Intervala and Westmoreland County Community College have teamed up to create a comprehensive electronics technician training program.

Bimos appointed Z Tech Services its newest representative.

StenTech appointed Technica representative in the NorCal/West USA region, Cope representative in the Mid-East US, and EMC3 representative in Florida.

Ventec Giga Solutions appointed Leigh Allinson commercial director.

Thermal Vias are Ineffective. Here’s Why.
PCD&F/CIRCUITS ASSEMBLY

Efficient and Selective Gold Recovery Using Amine-Laden Polymeric Fibers Synthesized by a Steric Hindrance Strategy
Chemical Engineering Journal

Efficient and Selective Gold Recovery Using Amine-Laden Polymeric Fibers Synthesized by a Steric Hindrance Strategy
Journal of Electronic Materials

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.