APPLE’S latest iPhones use components made by Intel, Micron Technology and Toshiba, among others, according to two firms that cracked open iPhone Xs and Xs Max models.

REVOLVE TECHNOLOGIES has successfully developed fuel cell technology using a PCB construction. This will be the first time that a PCB-based fuel cell has been developed for an automotive application.

FUJIPLOY debuts Zebra Gold 8000A connectors.

MERCURY SYSTEMS has been contracted by an unnamed defense prime contractor for the first high-volume production shipment of its military-grade memory devices.

UP MEDIA GROUP will hold a workshop on controlling noise in PCBs featuring Rick Hartley in Chicago in October.

SAMSUNG is planning to curb growth in memory chip output next year to keep supplies tight amid an expected slowdown in demand, Bloomberg reported on Thursday, citing people briefed on the matter.

SANMINA-SCI is planning to invest €20 million to expand capacity in Hungary, according to reports.

AR AND VR headset shipments are expected to rise to 53.1 million units in 2022, a compound annual growth rate of 88%, according to IDC.

GARTNER says 28% of spending in key IT segments will shift to the cloud by 2022.

HUNTING’S ELECTRONICS DIVISION purchased Optel Software materials management and component traceability software.

ELECTRONICS and furniture are about to get more expensive.

Z-AXIS named Steve Kelly director of business development and Massimo Amadio design engineering manager.

INVENTEC PERFORMANCE CHEMICALS named Dan Walker North American sales manager.

From the pages of
PRINTED CIRCUIT DESIGN & FAB:
In the World PCB Rankings, Flex Shows Its Muscle
The annual list of the largest fabricators shows flex circuit makers are beginning to dominate.
by Dr. Hayao Nakahara

From the pages of
CIRCUITS ASSEMBLY:
Trends in Medical Device Technology
Next-generation devices will rely on 3-D interconnect technology and power “scavenging.”
by Donald Banks

EVENTS

Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.