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November 15th, 2018
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

AI is not “magic dust” for your company, says Google’s Cloud AI boss.

ROBOT RIDE SERVICES could shake up the commercial office market by 2030.

EMA launches Ultra Librarian Reference Design Cloud EDA model library.

DATA I/O upgrades LumenX v. 1.6 chip programmer.

THIS WEEK ON PCB CHAT, Mike Buetow speaks with the authors of a new book on printed circuit board design.

MOUSER announced a new partnership with SamacSys to provide schematic symbols and 3D models for more than 1.1 million components.

Laminate Choice, Signal Integrity, and Other Tradeoffs
As I type this, I’m still considering about five column names. I have a lot to say about printed circuit materials, which I find super interesting, and all the candidates have the word “material” in them.

Bill Hargin



FOXCONN’S PLAN TO BUILD a multi-billion-dollar factory in Wisconsin is shining a spotlight on the worsening business environment in the US, particularly for Chinese companies.

INVENTEC has expressed caution about its outlook for the fourth quarter and 2019, citing impacts of the ongoing US-China trade spats, tight supply of Intel CPUs, and weakening demand for Windows 10-based business notebooks.

UP MEDIA GROUP seeks abstracts for PCB West 2019, to be held next September in Santa Clara, CA.

FOXCONN reported $19.2 billion in consolidated sales for October, up 21.5% year-over-year and 0.82% sequentially, the second-highest monthly figure in the firm’s history.

QUANTA acquired 312,000 sq. ft. of building space on a new campus in Guishan District, Taoyuan City, Taiwan.

MACROFAB named Misha Govshteyn chief executive and Chris Church chief product officer.

PETERS named Michael Kollasa head of the sales representative department.

CONECSUS welcomed Annette Pirro as customer service and administrative assistant.

The Value of Experience, Design Gurus, and Attention to Detail
The importance of the PCB as a highly technical component in advanced electronic products is often underestimated. In terms of sheer cubic volume, it’s usually the largest single component in the bill of materials (BoM).

Martin Cotton



From the pages of
Achieving Fine Lines and Spaces Using MSAP
A method to form fine-line circuits on organic substrates using traditional plating equipment.
by Rich Bellemare and Jordan Kologe

From the pages of
How Asteelflash Plans to Automate Customization
The EMS company’s engineers are making steady gains toward the lights-out factory.
by Mike Buetow


Dec. 5-7: International Printed Circuit & Apex South China Fair, Shenzhen, China
Dec. 13-15: Semicon Japan, Tokyo, Japan
Jan. 16-18: Nepcon Japan, Tokyo, Japan
Jan. 29-31: IPC Apex 2019, San Diego, CA
Feb. 5-7: MD&M West, Anaheim, CA
May 1-2: Del Mar Electronics & Manufacturing Show, San Diego, CA
Sept. 9-11: PCB West, Santa Clara, CA
Sept. 22-26: SMTA International, Rosemont, IL
Nov. 12-15: Productronica, Munich, Germany


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           11/12/18 TREND
Sn $8.68 Down
Pb $0.88 Flat
Ag $211.12 Down
Cu $2.73 Up
             Sept. TREND
Semi equip. billings 1.8% Down
ICs 13.8% Down
PCBs 1.04 Down
Computers 5.42 Up

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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