For AI, memory chips are placed as close as possible to computing chips to reduce latency, but doing so cranks up the heat. Or does it? In another type of integration, Sony and TCL have signed an MOU to spin out Sony’s home entertainment television business into a joint venture majority-owned by TCL. 

3-D stacking an HBM on top of the GPU doubles the operating temperature inside the GPU, rendering it inoperable. But a team led by Imec has identified several engineering optimizations that ultimately could whittle down the temperature difference to nearly zero.

Researchers at the University of Glasgow unveiled an almost entirely biodegradable circuit board that they say performs comparably to conventional PCBs.

MSI updated its Ventus graphics card lineup with the RTX 5070 Ti Ventus PZ, featuring a white shroud, powder-coated metal backplate, and a magnetically attached cover over the 16-pin power connector.

Zestron has released a new white paper detailing how shrinking solder powder sizes increase flux residue and cleaning complexity in advanced electronics assembly and packaging.

ASMPT SMT Solutions launched the SIPLACE V SMT placement platform.

Zuken and LogicSwap release OrCAD to eCADSTAR migration module.

PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.

Maggie Frachioni discusses her transition into PCB design at General Motors and how PCEA’s Certified Printed Circuit Designer coursework reshaped her career path on the PCB Chat podcast.

Wally Rhines reviews the latest ECAD market data, including sustained year-over-year growth, regional sales shifts and employment trends across design and semiconductor tools on the PCB Chat podcast.

PCB West 2026 booth sales are now open to all exhibitors, with more than 60 percent of the floor already reserved following early access for returning companies.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Sony and TCL signed a memorandum of understanding to spin out Sony’s home entertainment television business into a joint venture majority-owned by TCL, which would hold a 51 percent stake.

Aspocomp reported preliminary 2025 results showing net sales rose 41 percent to EUR 38.8M.

PCEA has named Andy Shaughnessy as its first content architect, tasking the veteran PCB journalist with leading technical publications and multimedia communications across the association.

Samsung Electronics has begun ramping activity at its Taylor, Texas foundry as rising AI chip demand accelerates the company’s US manufacturing timeline.

OpenAI launched a 10-year request for proposals to build a US-based hardware manufacturing ecosystem spanning data center modules, robotics components and consumer devices.

Taiyo Nippon Sanso plans to build an Advanced Electronics Materials Development Building, scheduled for completion in March 2027.

Yamaha Robotics has integrated its German liaison office into Yamaha Motor Europe’s robotics business.

Distron has become the first US electronics manufacturer to deploy Keiron’s HF2 LIFT-based precision solder paste printing technology.

AIM Solder appointed Angel Lopez as technical support engineer for North America.

BAE Systems promoted Ray Whittier to operations affordability lead.

Texmac-Takaya Group named Barb Koczera Western regional sales manager.

Jabil named Jonathan Molina engineering manager.

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EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.