AI’s appetite for memory is squeezing global supply chains just as the international e-waste trade faces a shakeup. An ECAD giant’s PCB sales took a step back in Q4.

Keysight introduces 3D Interconnect Designer for chiplet packages.

Malaysia has imposed an absolute ban on electronic waste imports after intercepting nearly 200 tonnes at Port Klang.

Molex launches Impress copackaged copper solutions.

Researchers from the Karlsruhe Institute of Technology and Arizona State University have developed a hierarchical defect-injection framework that boosts flexible IGZO-based ADC reliability by up to 92 percent under single defects.

The University of Arkansas has been awarded 3.5M to upgrade existing equipment used in electronics assembly and expand its semiconductor lab's capabilities.

Jabil released its Fiscal Year 2025 Sustainability Progress Report.

3G Shielding Specialties launches Advanced PCB EMI Reduction Solutions for high-density boards.

Scott Bright discusses Cadstrom IO’s new platform for catching errors the ERC flow misses with Andy Shaughnessy and Mike Buetow on the PCB Chat podcast.

Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.

PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Cadence’s System Design and Analysis business grew 13 percent in 2025.

Memory shortages are worsening as Samsung, SK Hynix and Micron struggle to meet AI data center demand while supplying consumer devices, driving price increases across PCs, smartphones and gaming hardware.

Creative 3D Technologies raised $5M in seed funding to scale its EVO modular manufacturing system and advance development of a semiconductor-focused Fab-in-a-Box platform.

IntechPro will invest more than 230 million rubles to launch computer production using Russian components and PCBs at Technopolis Moscow.

ECIA released a notice addressing new 25 percent ad valorem duties on certain semiconductor imports under Section 232, outlining key points and recommended actions for companies navigating evolving US Customs guidance.

Rabbit Product Design announced expanded IoT electronics design services.

Foxconn has denied a media report regarding its fiscal 2026 revenue target, pushing back on claims about its financial outlook and reiterating that any official guidance will be disclosed through formal channels.

NITI Aayog is urging India to move beyond assembly-led electronics manufacturing toward higher-value activities such as PCB design, semiconductor assembly and testing and power electronics.

MIC Electronics has entered into a memorandum of understanding with Refit Global Private Limited as part of its strategic evaluation of entry into the refurbished and circular electronics segment as a potential new growth vertical.

Unimicron Technology chairman Tzyy-jang Tseng has retired.

Building Relationships with AI Technology
PCD&F/CIRCUITS ASSEMBLY

AI-Enhanced Sorting Enabling Direct, High-Purity Urban Mining of Tantalum: A Novel Pathway from E-Waste to Critical Materials
Resources, Conservation & Recycling

Quad-Band Metamaterial Absorber with High Shielding Effectiveness Using Bold X-Shaped Ring Resonator
Journal of Electronic Materials

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.